Zvisiri zvemazuva ano / Zvishandiso zvakakosha
Aluminium Alloy Packages
KUTSANANGURWA FUPI:
Zvakanakira zvealuminium alloy huremu hwayo huremu, kusimba kwakasimba, uye nyore kwainogona kuumbwa.Sezvo zvakadaro inoshandiswa zvakanyanya mukugadzirwa kwemagetsi ekuputira.
ZVINHU ZVIKURU:
High thermal conductivity
•Low density
•Good platability uye workability, waya yekucheka, kukuya uye pamusoro pegoridhe plating inogona kuitwa.
| MODEL | COEFFICIENT OF THERMAL EXPANSION/×10-6 /K | THERMAL CONDUCTIVITY/W.(mK)-1 | DNSITY OF/g.cm-3 |
| A1 6061 | 22.6 | 210 | 2.7 |
| A1 4047 | 21.6 | 193 | 2.6 |
Aluminium Silicon Metal Packages
KUTSANANGURWA FUPI:
Si/Al alloys emapakeji emagetsi anonyanya kureva eutectic alloy zvinhu zvine silicon zvemukati 11% kusvika 70%.Kuwanda kwayo kwakadzikira, iyo coefficient yekuwedzera kwemafuta inogona kuenzaniswa nechip uye substrate, uye kugona kwayo kudzima kupisa kwakanakisa.Kuita kwayo machining kwakanakirawo.Nekuda kweizvozvo, Si/Al alloys ane hukuru hukuru muindasitiri yekurongedza yemagetsi.
ZVINHU ZVIKURU:
• Kukurumidza kupisa kupisa uye high thermal conductivity kunogona kugadzirisa matambudziko ekupisa kupisa kunowanikwa mukugadzirwa kwezvigadzirwa zvepamusoro-simba.
• Iyo coefficient yekuwedzera kwemafuta inodzoreka, izvo zvinoita kuti zvikwanise kuenderana neiyo chip, kudzivirira zvakanyanya kupisa kunetseka kunogona kukonzera kukanganisa kwechigadzirwa.
•Low density
| CE Alloy zita | CE20 | CE17 | CE17M | CE13 | CE11 | CE9 | CE7 |
| Alloy composition | Al-12%Si | Al-27%Si | Al-27%Si* | Al-42%Si | Si-50% Al | Si-40% Al | Si-30% Al |
| CTE,ppm/℃,25-100℃ | 20 | 16 | 16 | 12.8 | 11 | 9 | 7.4 |
| Density,g/cm3 | 2.7 | 2.6 | 2.6 | 2.55 | 2.5 | 2.45 | 2.4 |
| Thermal Conductivity pa25℃ W/mK | 177 | 147 | 160 | 149 | 129 | 120 | |
| Bend Simba, MPa | 210 | 213 | 172 | 140 | 143 | ||
| Goho Simba, MPa | 183 | 155 | 125 | 134 | 100 | ||
| Elastic Modulus, GPA | 92 | 92 | 107 | 121 | 124 | 129 |
Dhaimondi/Mhangura, Dhaimondi/Aluminium
KUTSANANGURWA FUPI:
Dhaimondi/Mhangura uye Dhaimondi/Aluminium zvinhu zvakaumbwa nedhaimani sechikamu chekusimbisa uye mhangura kana aluminium sematrix zvinhu.Aya anonyanya kukwikwidza uye anovimbisa zvemagetsi kurongedza zvinhu.Kune ese madhaimondi / mhangura uye diamondi / aluminium simbi yekugara, iyo inopisa conductivity ye chip nzvimbo ndeye ≥500W/( m • K) -1, inogutsa zvinodiwa zvekushanda kwekupisa kwakanyanya kwedunhu.Nekuenderera mberi kwekuwedzera kwekutsvagisa, marudzi aya edzimba achaita basa rinowedzera kukosha mumunda wekurongedza zvemagetsi.
ZVINHU ZVIKURU:
• High thermal conductivity
• The coefficient of thermal expansion (CTE) inogona kudzorwa nekushandura chikamu chikuru chedhaimondi uye Cu zvinhu.
•Low density
• Yakanaka platability uye kushanda, waya yekucheka, kukuya uye pamusoro pegoridhe plating inogona kuitwa
| MODEL | DIAMOND60%-COPPER40% | DIAMOND40%-COPPER60% | DIAMOND ALUMINIUM |
| COEFFICIENT YEKUKUDZWA KWEKUTESA/×10-4/K | 4 | 6 | 7 |
| THERMAL CONDUCTIVITY/W.(mK)-1 | 600 | 550 | >450 |
| DNSITY OF/g.cm-3 | 4.6 | 5.1 | 3.2 |
AlN substrate
KUTSANANGURWA FUPI:
Aluminium nitride ceramic ndeye tekinoroji ceramic zvinhu.Iyo ine yakanakisa yekupisa, yemagetsi uye yemagetsi zvivakwa, senge yakakwira magetsi conductivity, diki diki dielectric kugara, mutsara wekuwedzera coefficient inoenderana nesilicon, yakanakisa magetsi insulation, uye yakaderera density.Haina chepfu uye yakasimba.Nekukura kwakapararira kwemidziyo yemagetsi, aluminium nitride ceramics sechinhu chakadzika kana yeimba yepakeji, yakawedzera kufarirwa.Iyo inovimbisa yakakwirira-simba yakasanganiswa yedunhu substrate uye yekurongedza zvinhu.
ZVINHU ZVIKURU:
•High thermal conductivity (inenge 270W/m•K), pedyo neBeO neSiC, uye kanopfuura ka5 pane yeAl2O3
• Thermal yekuwedzera coefficient inoenderana neSi neGaAs
• Yakanakisa magetsi emagetsi (zvishoma dielectric kugara, dielectric kurasikirwa, vhoriyamu resistivity, dielectric simba)
• High mechanical simba uye yakanaka Machining kuita
•Ideal optical uye microwave maitiro
•Isina chepfu
HUNHU KUDZORA
Kwemakore isu takanyatso gadzirisa yedu-nhanho maitiro ekuona kuti chimwe nechimwe chikamu chinopfuura ese emhando uye mashandiro ebvunzo, bvunzo dzinotanga kunyangwe zvisati zvagadzirwa zvinhu.Panguva ino yekutanga, kutumirwa kwega kwega kwezvinhu zvakabikwa kunoitwa yekugamuchirwa sampling nzira assortment iyo inoita tsidzo yekubvuma izvo zvinhu.Kana kutsunga kwakadaro kukaitwa, kutakurwa kwese kunocheneswa, kuongororwa kuzere kunoitwa, zvikanganiso zvidiki zvinoputirwa uye kukwenenzverwa, uye masheya anobva achengetwa.Danho rechipiri rinoitwa pakarepo mushure mekutanga kuungana uye matanho ekugadzirisa.Chigadzirwa chega chega chinoitwa chega chega chekuongorora chinoteverwa neyekutanga hermeticity bvunzo.Kune hermeticity isu tinoshandisa helium leak bvunzo iyo inogadziriswa kuti isangane neiyo chaiyo mhepo kusimba zvinodiwa nevatengi vedu.Kutevera nhanho yeplating, batch yega yega inoongororwa sampling uye necoating bonding degree kuongororwa.Zvigadzirwa zvinoita kuti zvipfuure nhanho iyi zvinobva zvaongororwa zvizere izvo zvinosanganisira kuongororwa kwechitarisiko, kuvaka, plating ukobvu, uye yechipiri helium tracer gasi hermeticity bvunzo.Pakupedzisira zvigadzirwa zvinoiswa kuburikidza nehuwandu hwakazara hweFactory Inspection miedzo.Izvi zvinosanganisira pini kuneta bvunzo, munyu wekupfapfaidza corrosion kuramba bvunzo uye ongororo inovimba nemamiriro ekunze simulation michina kuyedza kuita kwechigadzirwa.Kana zvigadzirwa zvatenderwa, ivo pachavo vacuum-yakazara ne deoxidizing desiccant kuisa uye yakavharirwa mune yekuwedzera yekudzivirira packaging isati yatumirwa kunze.Kuedza uku kunovimbisa kuti chero chigadzirwa cheJitai chinounzwa kwauri chemhando yepamusoro sepayakabva mufekitori.
